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* Headquarters and Plant |
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Production Line |
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Headquarters and Plant
Trustworthy products are manufactured on our exclusive automated, fully integrated equipment.
IC and Transistor Production Line
[ Assembly Process ]
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Wafers are cut using a blade (diamond grindstone) to separate into pellets. |
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The bonding pads of pelletized frames and leads are electrically bonded by gold wires. |
[ Screening process ]
Module Production Line
[ Assembly Process ]
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Chip components are mounted on boards.
[ Feature ]
A high-speed chip mounter handles diverse components flexibly.
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[ Screening process ]
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Product electrical characteristics are tested.
[ Feature ]
High reliability marking a system availability ratio of over 97%, coupled with high speed from a test processing time of only 500 milliseconds per device, fulfills the needs for lower costs of testing and higher throughput. |
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