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Renesas High Components, Inc.
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  A Message from the President

President



Renesas High Components Co., Ltd., was founded in Tsugaru, Aomori Prefecture, in 1981 based on an investment from Renesas Eastern Japan Semi-Conductor Co., Ltd. Since then, the company has been manufacturing semiconductor elements (from assembly to testing) following the progress of the electronic industry.

Renesas High Components Co., Ltd., receives a wide variety of orders from semiconductor chip wafer processing (including back grinding and dicing) to packaging and testing. Automatic integrated assembly lines with different equipment configurations, which are selectable according to product size and numbers of pins, offer high production efficiency and smooth, waste-free production from small lots to large lots.

Renesas High Components Co., Ltd., has high production technologies for small, thin and multi-pin packages, modules, and RFID for digital and mobile equipment with flexible production systems to handle product diversification. All employees promptly incorporate the most advanced technologies and make every effort to timely provide customers with products that meet customers’ needs . Renesas High Components Co., Ltd., will strive to be a company customers can rely upon.

Shigeru Takeuchi
President




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